Description

Published annually in April.

This volume contains 147 standards.

Subjects cover:

• Innerlayer Interconnections and Bonding
• Materials and Processes for Vacuum Tubes
• Electronic Device Characterization
• Hermetic Seals
• Hybrid Circuits and Substrates
• Microelectronic Packaging
• Leak Testing
• and more

This volume also includes the latest standards relating to
• Declarable substances in materials
• 3D imaging systems
• Additive manufacturing technologies

Product Details

Published:

04/01/2021

ISBN(s):

9781682217696

Number of Pages:

1274