Description
Prescribes processes for using semiconductor devices in wider temperature ranges than those specified by the device manufacturer.
Cross References: IEC PAS, Electronic Component Management Plans*IEC 60134*
Product Details
- Published:
- 07/15/2001
- ISBN(s):
- 0580377768
- Number of Pages:
- 54
- File Size:
- 1 file , 890 KB
- Product Code(s):
- 30045251, 30045251, 30045251
